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At the end of 2022, ASML suddenly accelerated the delivery of lithography machines to Chinese chip companies, and Japanese lithography machine companies also expressed their favor to China. JCET recently stated that it has successfully realized the 4nm process of mobile phone SOC chip packaging, which may explain the sudden change of attitude of Japan and ASML. JCET said that it has independently developed the multi-dimensional advanced packaging technology XDFOI, which can realize the packaging of 4nm mobile phone SOC chips. This is another major breakthrough in China's chip technology, which is of great significance to the development of China's chip. As we all know, the shorter the manufacturing process, the smaller the transistors, the shorter the spacing between transistors, and the shorter the line spacing. And how to accurately connect the wires on the chip with the external interface is also a very high technical content."China Focus" is a YouTube channel created to provide current events and pop culture headlines from China.Here you can get to know a more real China through my video. ｜ #ChineseNews #chips #ChinaFocus Thanks for your watching and subscribing.